Intel® Core™ i7 Processor The best desktop processors on the planet:
Brilliantly fast:
With faster, intelligent, multi-core technology that applies processing power where it's needed most, new Intel® Core™ i7 processors deliver an incredible breakthrough in PC performance. They are the best desktop processors on the planet.¹
You'll multitask applications faster and unleash incredible digital media creation. And you'll experience maximum performance for everything you do, thanks to the combination of Intel® Turbo Boost technology² and Intel® Hyper-Threading technology (Intel® HT technology)³, which maximizes performance to match your workload.
Sunday, June 7, 2009
New $3 Billion Facility to Produce Processors with Intel 45nm Hafnium-based High-k Metal Gate Transistors CHANDLER, Ariz., Oct. 25, 2007 – Production
New $3 Billion Facility to Produce Processors with Intel 45nm Hafnium-based High-k Metal Gate Transistors
CHANDLER, Ariz., Oct. 25, 2007 – Production of a new generation of microprocessors for PCs, laptops, servers and other computing devices officially began today inside of Intel Corporation's first high-volume 45 nanometer (nm) manufacturing factory in Chandler, Ariz.
Called "Fab 32," the $3 billion factory will use Intel's innovative 45nm process technology based on Intel's breakthrough in "reinventing" certain areas of the transistors inside its processors to reduce energy leakage. The 45nm transistors use a Hafnium-based high-k material for the gate dielectric and metal materials for the gate, and are so small that more than 2 million can fit on the period at the end of this sentence. Millions of these tiny transistors will make up Intel's faster, more energy efficient lead- and halogen-free processors for PCs, laptops and servers, as well as ultra low-power processors for mobile Internet and consumer electronic devices, and low-cost PCs. The first of the company's 45nm processors is scheduled to be introduced on Nov. 12.
"The opening of Fab 32 in Arizona today is a testament to Intel's continued investment in our most strategic asset -- the most advanced, environmentally friendly manufacturing network in the world," said Paul Otellini, Intel president and CEO. "The magic of 45nm and our new transistor design allow us to deliver high-performance, energy-efficient processors to our customers across the entire spectrum of market segments, from the most powerful servers to a variety of mobile devices and everything in between."
Fab 32 is Intel's sixth 300mm wafer factory and its second factory to produce 45nm chips. Intel first produced 45nm processors in its Oregon development facility, called D1D, in January and is now moving into high-volume production with the opening of Fab 32. Two additional 45nm, 300mm manufacturing factories are scheduled to open next year in Kiryat Gat, Israel (Fab 28) and Rio Rancho, N.M. (Fab 11x). Using 300mm wafers lowers the production cost per chip while diminishing overall use of resources.
With 184,000 square feet of clean room space, the completed Fab 32 structure measures 1 million square feet, so large that more than 17 U.S. football fields could fit inside the building. More than 1,000 employees will operate the factory in such positions as process, automation and yield engineers and senior manufacturing technicians.
CHANDLER, Ariz., Oct. 25, 2007 – Production of a new generation of microprocessors for PCs, laptops, servers and other computing devices officially began today inside of Intel Corporation's first high-volume 45 nanometer (nm) manufacturing factory in Chandler, Ariz.
Called "Fab 32," the $3 billion factory will use Intel's innovative 45nm process technology based on Intel's breakthrough in "reinventing" certain areas of the transistors inside its processors to reduce energy leakage. The 45nm transistors use a Hafnium-based high-k material for the gate dielectric and metal materials for the gate, and are so small that more than 2 million can fit on the period at the end of this sentence. Millions of these tiny transistors will make up Intel's faster, more energy efficient lead- and halogen-free processors for PCs, laptops and servers, as well as ultra low-power processors for mobile Internet and consumer electronic devices, and low-cost PCs. The first of the company's 45nm processors is scheduled to be introduced on Nov. 12.
"The opening of Fab 32 in Arizona today is a testament to Intel's continued investment in our most strategic asset -- the most advanced, environmentally friendly manufacturing network in the world," said Paul Otellini, Intel president and CEO. "The magic of 45nm and our new transistor design allow us to deliver high-performance, energy-efficient processors to our customers across the entire spectrum of market segments, from the most powerful servers to a variety of mobile devices and everything in between."
Fab 32 is Intel's sixth 300mm wafer factory and its second factory to produce 45nm chips. Intel first produced 45nm processors in its Oregon development facility, called D1D, in January and is now moving into high-volume production with the opening of Fab 32. Two additional 45nm, 300mm manufacturing factories are scheduled to open next year in Kiryat Gat, Israel (Fab 28) and Rio Rancho, N.M. (Fab 11x). Using 300mm wafers lowers the production cost per chip while diminishing overall use of resources.
With 184,000 square feet of clean room space, the completed Fab 32 structure measures 1 million square feet, so large that more than 17 U.S. football fields could fit inside the building. More than 1,000 employees will operate the factory in such positions as process, automation and yield engineers and senior manufacturing technicians.
Intel® Turbo Boost Technology:
Intel® Turbo Boost Technology is one of the many exciting new features that Intel has built into latest-generation . It automatically allows processor cores to run faster than the base operating frequency if it's operating below power, current, and temperature specification limits.
Dynamically increasing performance
As an independent and complimentary feature, (Intel® HT Technology) along with Intel Turbo Boost Technology increases performance of both multi-threaded and single threaded workloads. Intel Turbo Boost Technology is activated when the Operating System (OS) requests the highest processor performance state (P0).
The maximum frequency of Intel® Turbo Boost Technology is dependent on the number of active cores. The amount of time the processor spends in the Intel Turbo Boost Technology state depends on the workload and operating environment, providing the performance you need, when and where you need it.
Any of the following can set the upper limit of Intel Turbo Boost Technology on a given workload:
• Number of active cores
• Estimated current consumption
• Estimated power consumption
• Processor temperature
When the processor is operating below these limits and the user's workload demands additional performance, the processor frequency will dynamically increase by 133 MHz on short and regular intervals until the upper limit is met or the maximum possible upside for the number of active cores is reached. Conversely, when any of the limits are reached or exceeded, the processor frequency will automatically decrease by 133 MHz until the processor is again operating within its limits.
Dynamically increasing performance
As an independent and complimentary feature, (Intel® HT Technology) along with Intel Turbo Boost Technology increases performance of both multi-threaded and single threaded workloads. Intel Turbo Boost Technology is activated when the Operating System (OS) requests the highest processor performance state (P0).
The maximum frequency of Intel® Turbo Boost Technology is dependent on the number of active cores. The amount of time the processor spends in the Intel Turbo Boost Technology state depends on the workload and operating environment, providing the performance you need, when and where you need it.
Any of the following can set the upper limit of Intel Turbo Boost Technology on a given workload:
• Number of active cores
• Estimated current consumption
• Estimated power consumption
• Processor temperature
When the processor is operating below these limits and the user's workload demands additional performance, the processor frequency will dynamically increase by 133 MHz on short and regular intervals until the upper limit is met or the maximum possible upside for the number of active cores is reached. Conversely, when any of the limits are reached or exceeded, the processor frequency will automatically decrease by 133 MHz until the processor is again operating within its limits.
Embedded Systems:
In February 2002, AMD acquired Alchemy Semiconductor and continued its line of processor in MIPS architecture processors, targets the hand-held and Portable media player markets. On 13 June 2006, AMD officially announced that the Alchemy processor line was transferred to Raza Microelectronics Inc.
In August 2003, AMD also purchased the Geode business which was originally the Cyrix MediaGX from National Semiconductor to augment its existing line of embedded x86 processor products. During the second quarter of 2004, it launched new low-power Geode NX processors based on the K7 Thoroughbred architecture with speeds of fanless processors 667 MHz and 1 GHz, and 1.4 GHz processor with fan, of TDP 25 W. This technology is used in a variety of embedded systems (Casino slot machines and customer kiosks for instance), several UMPC designs in Asia markets, as well as the OLPC XO-1 computer, an inexpensive laptop computer intended to be distributed to children in developing countries around the world.
For the past couple of years AMD has been introducing 64-bit processors into its embedded product line starting with the AMD Opteron processor. Leveraging the high throughput enabled through HyperTransport and the Direct Connect Architecture these server class processors have been targeted at high end telecom and storage applications. In 2006 AMD added the AMD Athlon, AMD Turion and Mobile AMD Sempron processors to its embedded product line. Leveraging the same 64-bit instruction set and Direct Connect Architecture as the AMD Opteron but at lower power levels and in smaller footprint packages, these processors were well suited to a variety of traditional embedded applications. Throughout 2007 supporting longer than standard availability.
In April 2007, AMD announced the release of the M690T integrated graphics chipset for embedded designs. This enabled AMD to offer complete processor and chipset solutions targeted at embedded applications requiring high performance 3D and video such as emerging digital signage, kiosk and Point of Sale applications. The M690T was followed by the M690E specifically for embedded applications which removed the TV output, which required Macrovision licensing for OEMs, and enabled native support for dual TMDS outputs, enabling dual independent DVI interfaces.
and into 2008 AMD has continued to add both single-core Mobile AMD Sempron and AMD Athlon processors and dual-core AMD Athlon X2 and AMD Turion processors to its embedded product line and now offers embedded 64-bit solutions starting with 8W TDP Mobile AMD Sempron and AMD Athlon processors for fan-less designs up to multi-processor systems leveraging multi-core AMD Opteron processors all
In August 2003, AMD also purchased the Geode business which was originally the Cyrix MediaGX from National Semiconductor to augment its existing line of embedded x86 processor products. During the second quarter of 2004, it launched new low-power Geode NX processors based on the K7 Thoroughbred architecture with speeds of fanless processors 667 MHz and 1 GHz, and 1.4 GHz processor with fan, of TDP 25 W. This technology is used in a variety of embedded systems (Casino slot machines and customer kiosks for instance), several UMPC designs in Asia markets, as well as the OLPC XO-1 computer, an inexpensive laptop computer intended to be distributed to children in developing countries around the world.
For the past couple of years AMD has been introducing 64-bit processors into its embedded product line starting with the AMD Opteron processor. Leveraging the high throughput enabled through HyperTransport and the Direct Connect Architecture these server class processors have been targeted at high end telecom and storage applications. In 2006 AMD added the AMD Athlon, AMD Turion and Mobile AMD Sempron processors to its embedded product line. Leveraging the same 64-bit instruction set and Direct Connect Architecture as the AMD Opteron but at lower power levels and in smaller footprint packages, these processors were well suited to a variety of traditional embedded applications. Throughout 2007 supporting longer than standard availability.
In April 2007, AMD announced the release of the M690T integrated graphics chipset for embedded designs. This enabled AMD to offer complete processor and chipset solutions targeted at embedded applications requiring high performance 3D and video such as emerging digital signage, kiosk and Point of Sale applications. The M690T was followed by the M690E specifically for embedded applications which removed the TV output, which required Macrovision licensing for OEMs, and enabled native support for dual TMDS outputs, enabling dual independent DVI interfaces.
and into 2008 AMD has continued to add both single-core Mobile AMD Sempron and AMD Athlon processors and dual-core AMD Athlon X2 and AMD Turion processors to its embedded product line and now offers embedded 64-bit solutions starting with 8W TDP Mobile AMD Sempron and AMD Athlon processors for fan-less designs up to multi-processor systems leveraging multi-core AMD Opteron processors all
Intel® Core™2 Extreme dual-core mobile processor (X9100):
Designed for gamers and power-users, the Intel Core 2 Extreme dual-core mobile processor the is world's highest performing dual-core processor². For those who want an intense, high-performance mobile computing experience, the Intel Core 2 Extreme dual-core mobile processor delivers revolutionary mobile dual-core performance with 3.06GHz frequency, 6MB of shared L2 Advanced Smart Cache, and Intel® Smart Memory Access with a blazing 1066MHz Front Side Bus (FSB).
Experience excellent mobile gaming and multimedia with the raw power, responsiveness and realism of revolutionary mobile dual-core performance. The Intel Core 2 Extreme dual-core mobile processor brings a whole new intensity to mobile gaming.
And just like its quad-core big brother, the Intel Core 2 Extreme dual-core mobile processor also offers the ultimate control to with bus ratio locks (overspeed protection) removed, so you can fine tune your notebook experience for maximum gaming performance.
Experience excellent mobile gaming and multimedia with the raw power, responsiveness and realism of revolutionary mobile dual-core performance. The Intel Core 2 Extreme dual-core mobile processor brings a whole new intensity to mobile gaming.
And just like its quad-core big brother, the Intel Core 2 Extreme dual-core mobile processor also offers the ultimate control to with bus ratio locks (overspeed protection) removed, so you can fine tune your notebook experience for maximum gaming performance.
Intel® Core™2 Extreme quad-core mobile processor (QX9300):
Achieving clock speeds of up to 2.53GHz, along with an astounding 12 MB of shared L2 cache and a 1066 MHz Front Side Bus (FSB), the Intel Core 2 Extreme quad-core mobile processor is your ultimate engine for hi-def multimedia while powering the latest generation of hardcore games.
The Intel Core 2 Extreme quad-core mobile processor has four cores processing multiple threads and multiple tasks at blistering speeds for an incredible "like you're there" experience in advanced artificial intelligence (AI), particle systems, dynamic physics, and texture generation. As your ultimate engine for creating rich, HD videos with up to 50 percent faster performance when encoding³ and editingΩ video, these processors enable you to perform like a multiple armed monster.
And because you're looking for ultimate control in game, the Intel Core 2 Extreme quad-core mobile processor bus ratio locks (overspeed protection) have been removed, so you can fine tune your notebook experience for maximum gaming performance.
The Intel Core 2 Extreme quad-core mobile processor has four cores processing multiple threads and multiple tasks at blistering speeds for an incredible "like you're there" experience in advanced artificial intelligence (AI), particle systems, dynamic physics, and texture generation. As your ultimate engine for creating rich, HD videos with up to 50 percent faster performance when encoding³ and editingΩ video, these processors enable you to perform like a multiple armed monster.
And because you're looking for ultimate control in game, the Intel Core 2 Extreme quad-core mobile processor bus ratio locks (overspeed protection) have been removed, so you can fine tune your notebook experience for maximum gaming performance.
Intel® Core™2 Extreme Mobile Processor:
Designed from the ground up for extreme competitive gaming and HD multimedia on the fly, the Intel® Core™2 Extreme processors are the world's highest performing quad-core and dual-core mobile processors. Delivering all the performance of a desktop, enabled in a revolutionary, sleek, and killer notebook.
As your ultimate engine for hi-def digital content creation, HD multimedia, and a rockin' hardcore gaming experience, these notebooks provide the raw power, responsiveness, and realism you need for the most compute-intensive and multi-threaded apps-wherever you want to be.
As your ultimate engine for hi-def digital content creation, HD multimedia, and a rockin' hardcore gaming experience, these notebooks provide the raw power, responsiveness, and realism you need for the most compute-intensive and multi-threaded apps-wherever you want to be.
Intel® Atom™ Processor smallest chip:
Intel’s smallest and lowest power processor, the Intel® Atom™ processor will enable the industry to design new Mobile Internet Devices (MIDs) and affordable Internet-focused notebooks (netbooks), and desktops (nettops). This new processor also serves as the foundation for the all new Intel® Centrino® Atom™ processor technology, a collection of chips that enables amazing Internet experiences in pocketable devices.Newly designed from the ground up, 45nm Intel Atom processors pack an astounding 47 million transistors on a single chip measuring less than 25mm², making them Intel’s smallest and lowest power processors.¹ All this, and while still delivering the power* Get a new range of power-efficient devices with excellent performance enabled by all new hafnium-infused 45nm high-k silicon technology* Increase energy efficiency in smaller more compact designs with a thermal design power specification ranging from subwatt to 2.5 watts for mobile devices* Extend battery life in select devices with an incredibly low idle power as low as 30 mW allowing the device to stay powered on while also conserving energyPowering the next generation of Internet-centric devices, Intel Atom processors will power the latest in pocketable, portable devices. Based on an entirely new microarchitecture, the Intel Atom processor was developed specifically for performance and low power while maintaining full Intel® Core™ microarchitecture instruction set compatibility. Some Intel Atom processors will also feature multiple threads for better performance and increased system responsiveness.Devices powered by Intel Atom processors allow you to stay in touch on-the-go, connect to business and enjoy entertainment, remain connected affordably with a new series of netbooks and nettops, and so much more.
Intel® QuickPath Technology:
Unleashing performance with interconnect system architecture
Providing point-to-point high-speed links to distributed shared memory, Intel® QuickPath technology unleashes the parallel processing performance of next-generation Intel® 45nm microarchitectures (codenamed Nehalem and Tukwila). These microarchitectures, built from the ground up, will be the first to use the Intel QuickPath interconnect system and can see significant improvements in overall performance.
With new Intel QuickPath technology built into future Nehalem and Tukwila microarchitectures, each processor core will feature an integrated memory controller and high-speed interconnect, linking processors and other components to deliver:
• Dynamically scalable interconnect bandwidth designed to set loose the full performance of Nehalem, Tukwila, and future generations of Intel® multi-core processors.
• Outstanding memory performance and flexibility to support leading memory technologies.
• Tightly integrated interconnect reliability, availability, and serviceability (RAS) with design-scalable configurations for optimal balance of price, performance, and energy efficiency.
Providing point-to-point high-speed links to distributed shared memory, Intel® QuickPath technology unleashes the parallel processing performance of next-generation Intel® 45nm microarchitectures (codenamed Nehalem and Tukwila). These microarchitectures, built from the ground up, will be the first to use the Intel QuickPath interconnect system and can see significant improvements in overall performance.
With new Intel QuickPath technology built into future Nehalem and Tukwila microarchitectures, each processor core will feature an integrated memory controller and high-speed interconnect, linking processors and other components to deliver:
• Dynamically scalable interconnect bandwidth designed to set loose the full performance of Nehalem, Tukwila, and future generations of Intel® multi-core processors.
• Outstanding memory performance and flexibility to support leading memory technologies.
• Tightly integrated interconnect reliability, availability, and serviceability (RAS) with design-scalable configurations for optimal balance of price, performance, and energy efficiency.
Intel® Core™2 Duo Processors:
Based on Intel® Core™ microarchitecture, the Intel® Core™2 Duo processor family is designed to provide powerful energy-efficient performance so you can do more at once without slowing down.
Intel® Core™ 2 Duo desktop processors
With Intel Core 2 Duo desktop processor, you'll experience revolutionary performance, unbelievable system responsiveness, and energy-efficiency second to none.
Big, big performance. More energy efficient.¹ Now available in smaller packages. The Intel Core 2 Duo processor-based desktop PC was designed from the ground up for energy efficiency, letting you enjoy higher performing, ultra-quiet, sleek, and low power desktop PC designs.
Multitask with reckless abandon. Do more at the same time, like playing your favorite music, running virus scan in the background, and all while you edit video or pictures. The powerful Intel Core 2 Duo desktop processor provides you with the speed you need to perform any and all tasks imaginable.
Love your PC again. Don’t settle for anything less than the very best. Find your perfect desktop powered by the Intel Core 2 Duo processor and get the best processing technology money can buy. Only from Intel.
• Up to 6MB L2 cache.
• Up to 1333 MHz front side bus.,
Intel® Core™ 2 Duo desktop processors
With Intel Core 2 Duo desktop processor, you'll experience revolutionary performance, unbelievable system responsiveness, and energy-efficiency second to none.
Big, big performance. More energy efficient.¹ Now available in smaller packages. The Intel Core 2 Duo processor-based desktop PC was designed from the ground up for energy efficiency, letting you enjoy higher performing, ultra-quiet, sleek, and low power desktop PC designs.
Multitask with reckless abandon. Do more at the same time, like playing your favorite music, running virus scan in the background, and all while you edit video or pictures. The powerful Intel Core 2 Duo desktop processor provides you with the speed you need to perform any and all tasks imaginable.
Love your PC again. Don’t settle for anything less than the very best. Find your perfect desktop powered by the Intel Core 2 Duo processor and get the best processing technology money can buy. Only from Intel.
• Up to 6MB L2 cache.
• Up to 1333 MHz front side bus.,
Intel® Core™2 Quad Processors:
Introducing Intel® Core™2 Quad processor for notebook and desktop PCs, designed to handle massive compute and visualization workloads enabled by powerful multi-core technology. Optimized for the longest possible battery life without compromise to performance, Intel Core 2 Quad processors for notebooks allow you to stay unwired longer while running the most compute-intensive applications.
Providing all the bandwidth you need for next-generation highly-threaded applications, the latest four-core Intel Core 2 Quad processors are built on 45nm Intel® Core™ microarchitecture enabling faster, cooler, and quieter mobile and desktop PC and workstation experiences.
Plus, with optional Intel® vPro™ technology, you have the ability to remotely isolate, diagnose, and repair infected desktop and mobile workstations wirelessly and outside of the firewall, even if the PC is off, or the OS is unresponsive.
Features and Benefits:
With four processing cores, up to 12MB of shared L2 cache,and up to 1066 MHz Front Side Bus for notebooks, and up to 12MB of L2 cache² and up to 1333 MHz Front Side Bus for desktops, the Intel Core 2 Quad processor delivers amazing performance and power efficiency enabled by the all new hafnium-based circuitry of 45nm Intel Core microarchitecture.
Whether you're encoding, rendering, editing, or streaming HD multimedia in the office or on the go, power your most demanding applications with notebooks and desktops based on the Intel Core 2 Quad processor.
Providing all the bandwidth you need for next-generation highly-threaded applications, the latest four-core Intel Core 2 Quad processors are built on 45nm Intel® Core™ microarchitecture enabling faster, cooler, and quieter mobile and desktop PC and workstation experiences.
Plus, with optional Intel® vPro™ technology, you have the ability to remotely isolate, diagnose, and repair infected desktop and mobile workstations wirelessly and outside of the firewall, even if the PC is off, or the OS is unresponsive.
Features and Benefits:
With four processing cores, up to 12MB of shared L2 cache,and up to 1066 MHz Front Side Bus for notebooks, and up to 12MB of L2 cache² and up to 1333 MHz Front Side Bus for desktops, the Intel Core 2 Quad processor delivers amazing performance and power efficiency enabled by the all new hafnium-based circuitry of 45nm Intel Core microarchitecture.
Whether you're encoding, rendering, editing, or streaming HD multimedia in the office or on the go, power your most demanding applications with notebooks and desktops based on the Intel Core 2 Quad processor.
AMD's Turion 64X2:
Turion 64 X2 is AMD's 64-bit dual-core mobile CPU, intended to compete with Intel's Core and Core 2 CPUs. The Turion 64 X2 was launched on May 17, 2006, after several delays. These processors use Socket S1, and feature DDR2 memory. They also include AMD Virtualization Technology and more power-saving features.
AMD first produced the Turion 64 X2 on IBM's 90 nm Silicon on insulator (SOI) process (cores with the Taylor codename). As of May 2007, they have switched to a 65 nm Silicon-Germanium stressed process, which was recently achieved through the combined effort of IBM and AMD, with 40% improvement over comparable 65 nm processes. The earlier 90 nm devices were codenamed Taylor and Trinidad, while the newer 65 nm cores have codename Tyler.
AMD first produced the Turion 64 X2 on IBM's 90 nm Silicon on insulator (SOI) process (cores with the Taylor codename). As of May 2007, they have switched to a 65 nm Silicon-Germanium stressed process, which was recently achieved through the combined effort of IBM and AMD, with 40% improvement over comparable 65 nm processes. The earlier 90 nm devices were codenamed Taylor and Trinidad, while the newer 65 nm cores have codename Tyler.
AMD's Triple-core processor(Phenom):
AMD’s triple-core processors have been on the horizon for months now and, after all the speculation and derision, they are finally here. The launch included three Phenom X3 processors: the 8750, 8650, and 8450, all of which will come in at under $200. AMD is, as expected, positioning these processors between their dual-core and quad-core offerings and is targeting cost-conscious consumers, people who will appreciate the performance boost but would rather save a few dollars than go with a quad-core.The three 65nm models will arrive at 2.1, 2.3, and 2.4GHz frequencies, respectively priced at $145, $165, and a hefty $195 for the 8750. These models have a TDP of 95W and 1.5MB total L2 cache per processors as well as 2MB shared cache. Also included is HT 3.0, a 1.8GHz memory controller, and Dual Dynamic Power Management. And because this is a 50 series processor we know it is a B3 revision model. They are AM2+ (940 pin) compatible so consumers won’t necessarily need new hardware to run an X3.Having the basic information in front of you, it’s not immediately clear whether AMD is fulfilling a need that no one has, offering an interesting new option to consumers, or just making the best out of their situation (by releasing “broken” quad-cores as X3s). What we do know though is that outside of enthusiasts circles there won’t be the clamoring and complaints about the third core, rather it’ll probably be seen as nothing more (or less) than something between two other options.AMD is also touting a platform approach–not exactly admitting that they can’t compete with Intel on a processor-by-processor basis, but rather than their entire package is better than the competition’s. Specifically, this platform is “Cartwheel”, AMD’s current take on a main-stream computer with integrated graphics. By using the 780G chipset AMD could actually produce a better system (dollar-for-dollar) than Intel, so long as you subscribe to their platform approach, something that may actually make sense considering that most sub-$200 processors are found in pre-built computers.
Intel® Xeon Processor 5000 sequence:
Quad-Core® and Dual-Core® Intel® Xeon® processors for embedded computing platforms
Breakthrough performance, energy efficiency, extended lifecycle support and common socket Intel Xeon processor-based systems make them the ideal choice for compute-intensive embedded, storage and communications applications.
Lower thermal design power (TDP) and higher Tcase temperature Intel Xeon processor options are ideal options for low power consumption and/or compliance with the AdvancedTCA* form factor and NEBS level-3 thermal specifications These processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms for a wide range of applications. These include storage area networks (SANs), network attached storage (NAS), routers, IP-PBX, converged/unified communications platforms, sophisticated content firewalls, unified threat management (UTM) systems, medical imaging equipment, military signal and image processing, and telecommunications (wireless and wireline) servers.
• Intel® 5000P chipset-based platforms are ideal for full performance and memory-intense applications by providing a maximum FB-DIMM memory capacity of 64 GB, 28 lanes of PCI Express* and accelerated I/O options.
• Intel® 5100 Memory Controller Hub (MCH) chipset-based platforms are ideal for bladed and dense bladed applications requiring less than 200 watts, including AdvancedTCA and NEBS-compliance.
Breakthrough performance, energy efficiency, extended lifecycle support and common socket Intel Xeon processor-based systems make them the ideal choice for compute-intensive embedded, storage and communications applications.
Lower thermal design power (TDP) and higher Tcase temperature Intel Xeon processor options are ideal options for low power consumption and/or compliance with the AdvancedTCA* form factor and NEBS level-3 thermal specifications These processors are validated with two different chipsets, providing a choice of flexible, dual-processor-capable platforms for a wide range of applications. These include storage area networks (SANs), network attached storage (NAS), routers, IP-PBX, converged/unified communications platforms, sophisticated content firewalls, unified threat management (UTM) systems, medical imaging equipment, military signal and image processing, and telecommunications (wireless and wireline) servers.
• Intel® 5000P chipset-based platforms are ideal for full performance and memory-intense applications by providing a maximum FB-DIMM memory capacity of 64 GB, 28 lanes of PCI Express* and accelerated I/O options.
• Intel® 5100 Memory Controller Hub (MCH) chipset-based platforms are ideal for bladed and dense bladed applications requiring less than 200 watts, including AdvancedTCA and NEBS-compliance.
AMD 386
The Am386 CPU was released by AMD in 1991. A 100%-compatible clone of the Intel 80386 design, it sold millions of units and positioned AMD as a legitimate competitor to Intel, rather than just a second source for x86 CPUs (then termed 8086-family).
While the CPU was essentially ready to be released prior to 1991, Intel kept it tied up in court. AMD had previously been a second-source manufacturer of Intel's designs, and AMD's interpretation of the contract was that it covered all of them. Intel, however, claimed that the contract only covered the 80286 and prior processors. After a few years in the courtrooms, AMD finally won the case and the right to sell their Am386. This paved the way for competition also in the market for 8086-compatible 32-bit processors and lowered the cost of buying a PC.
While Intel's 386 design peaked at 33 MHz, AMD released a 40 MHz version of both its 386DX and 386SX, extending the lifespan of the architecture. The AMD 386DX-40 was popular with small manufacturers of PC clones and with budget-minded computer enthusiasts because it offered near-80486 performance at a much lower price than a real 486.
The 386DX-40 could match or even slightly outperform a 486SX-25 in popular benchmarks and many real-world applications, while costing less. Integer performance at 40 MHz thus approached that of low-end 486 CPUs, but rarely exceeded it. This is because the 486 needed fewer clock cycles per instruction, thanks to its tighter pipelining (more overlapping of internal processing) in combination with a crucical on-chip CPU cache. However, because the Am386DX-40 had the same 32-bit width on its data bus as an 80486, it had good memory and I/O performance even compared to many 486s.
Floating point performance could be boosted with the addition of an inexpensive 80387 coprocessor, although performance would still not approach that of the on-chip FPU of the 486DX. This made the Am386DX a suboptimal choice for scientific applications and CAD using floating point intensive calculations. However, both were niche markets in the early 1990s and the chip sold well, first as a mid-range contender, and then as a budget chip. Although motherboards using the older 386 CPUs often had limited memory expansion possibilties and therefore struggled under Windows 95's memory requirements, boards using the Am386 was sold well into the mid-1990s; at the end as budget motherboards for those who were only interested in running MS-DOS or Windows 3.1x applications. The Am386 and its low-power successors were also popular choices for embedded systems, for a much longer period than their life span as PC processors.
While the CPU was essentially ready to be released prior to 1991, Intel kept it tied up in court. AMD had previously been a second-source manufacturer of Intel's designs, and AMD's interpretation of the contract was that it covered all of them. Intel, however, claimed that the contract only covered the 80286 and prior processors. After a few years in the courtrooms, AMD finally won the case and the right to sell their Am386. This paved the way for competition also in the market for 8086-compatible 32-bit processors and lowered the cost of buying a PC.
While Intel's 386 design peaked at 33 MHz, AMD released a 40 MHz version of both its 386DX and 386SX, extending the lifespan of the architecture. The AMD 386DX-40 was popular with small manufacturers of PC clones and with budget-minded computer enthusiasts because it offered near-80486 performance at a much lower price than a real 486.
The 386DX-40 could match or even slightly outperform a 486SX-25 in popular benchmarks and many real-world applications, while costing less. Integer performance at 40 MHz thus approached that of low-end 486 CPUs, but rarely exceeded it. This is because the 486 needed fewer clock cycles per instruction, thanks to its tighter pipelining (more overlapping of internal processing) in combination with a crucical on-chip CPU cache. However, because the Am386DX-40 had the same 32-bit width on its data bus as an 80486, it had good memory and I/O performance even compared to many 486s.
Floating point performance could be boosted with the addition of an inexpensive 80387 coprocessor, although performance would still not approach that of the on-chip FPU of the 486DX. This made the Am386DX a suboptimal choice for scientific applications and CAD using floating point intensive calculations. However, both were niche markets in the early 1990s and the chip sold well, first as a mid-range contender, and then as a budget chip. Although motherboards using the older 386 CPUs often had limited memory expansion possibilties and therefore struggled under Windows 95's memory requirements, boards using the Am386 was sold well into the mid-1990s; at the end as budget motherboards for those who were only interested in running MS-DOS or Windows 3.1x applications. The Am386 and its low-power successors were also popular choices for embedded systems, for a much longer period than their life span as PC processors.
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